High Efficiency Cooling

Uniform Heat Distribution

Space-saving Design
Feature:

Utilizes vapor chamber technology to achieve efficient heat dissipation, rapidly conducting and dispersing heat to ensure stable operation of electronic devices under high loads. Its uniform heat distribution feature eliminates hotspots, enhancing device reliability. The compact three-dimensional design saves space, making it suitable for space-constrained electronic devices and systems.

Application:

High-performance computers and servers

High-density electronic devices

High-power LED lighting

Medical equipment

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