Press-fit Technology in IGBT Production

30 Oct 2023
Insulated Gate Bipolar Transistors (IGBTs), driven by rapid technological advancements, have emerged as pivotal components in domains like electric vehicles, solar energy, and industrial sectors. These power semiconductors are known for their high-voltage and high-power capabilities, making them indispensable in a range of applications. 
A crucial advancement in IGBT development is the incorporation of Press-fit technology during its production. This innovative approach is set to transform the manufacturing process, amplifying the efficiency and quality of IGBTs. 
Given the wide range of applications and the importance of IGBTs, it's imperative to explore techniques that enhance their production and performance. Here is where Nextron comes in, as a frontrunner in Press-fit technology.
How Does Press-fit Technology Elevate IGBT Production?
1. Optimized Assembly and Installation:
By utilizing Press-fit technology, the process of assembling IGBT modules can be streamlined. This technology eliminates thermal stresses and defects by replacing soldering with a "press-in" concept, resulting in more intuitive and robust connections.
With the help of specialized press tools, IGBT modules can be integrated seamlessly into the PCB, providing both precision and reliability in connections.
2. Elevating Efficiency and Flexibility:
The Press-fit technology enhances the performance of IGBT modules by providing an exceptionally low contact impedance, which reduces the Failure In Time (FIT) rate. It also strengthens module reliability and efficiency. 
Moreover, its compatibility with standard PCB materials displays its flexibility, ensuring its adaptability across various applications and setups.
3. Eco-friendly and Sustainable Practices:
Press-fit technology is an eco-friendly assembly method that promotes sustainability. It allows for PCB reuse up to three times with modules, and module reuse after pressing, reducing waste and promoting sustainability. 
The lead-free assembly of IGBT modules meets global environmental standards, demonstrating a commitment to environmental responsibility.
In summary, Press-fit technology has revolutionized IGBT production by markedly improving efficiency and quality. By hastening the assembly process, and ensuring environmentally conscious, lead-free, and solder-free connections, this method represents a significant advancement and transformation in IGBT module creation.
Nextron's Expertise in Press-fit Machines
Nextron's LPM3 press-fit machines have been industry leaders in recent years. These machines are user-friendly, cost-efficient, and significantly enhance component placement and monitoring.
After the LPM3, Nextron launched the LPM3 Mini, a more compact yet feature-rich machine tailored for industrial PCBs. With its touchscreen and remote access capabilities, it's designed for businesses seeking adaptable press-fit solutions. Importantly, all our models, including the LPM3 Mini, can be customized based on client requirements, ensuring both compatibility and cost-efficiency.

This website uses technical and analytical cookies, including third-party cookies, to analyse user browsing behaviour, create website visit statistics and improve the contents provided. To consult the full Cookie Policy or decline, at a later date, your consent to the cookies used by the website, click here.

Got It!