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  • 2021-04-19
    Micro D Connector with Cable Solution Featuring outstanding anti-vibration ability, Nextron’s newly launched Micro D is a lightweight connector well-suited in limited space. The ...
  • 2021-03-10
    Compact Thermal Solution for mmWave Radar As an essential part of future transportation, mmWave radar detects nearby objects and provides the range, velocity and angle of these objects. ...
  • 2021-03-07
    A 5G Heat Dissipation Solution: Fanless Industrial Chassis for Edge Computing Thermal Resistance & Ruggedized Marking a significant step in communication technology, 5G, IoT and ed...
  • 2020-12-31
    Small details, Big difference! SFP/SFP+ are Widely Adapted in 5G Era. Since 1976, optical fiber has gradually taken over the world of telecommunication and data transmission. Today, as...
  • 2020-12-07
    Chameleon Series Bidirectional Release Connector for Robotic Applications   As Industry 4.0 unfolds, the ecosystem of manufacturing has been elevated to a new stage. Computer...
  • 2020-04-13
      With the global spread of COVID-19, this pandemic crisis impacts all our beloved families, colleagues, friends, and even our familiar lifestyle.  ...
  • 2020-03-05
    GECKO HD SERIES FASTER, LIGHTER, SMALLER Expand from featured Gecko Series, New Gecko HD series accommodate high-speed data transmission with smaller sizes and reduced weights. A...
  • 2019-10-22
    NEXTRON’s unique VPX system solutions which designed specifically for rugged MIL specified embedded systems. Efficient cooled options and convertible open Frame Chassis are competent for Custom solutions. Compliant to the latest VITA 65 Standards, NEXTRON’ s standard 3U and 6U VPX X-Type test system platform include open frame, customized backplane, high power cooling system, configurable power supply unit. NEXTRON has over 20 years experience working with worldwide major brands for accelerating time-to-market and the best customized fully integrated applications.
  • 2019-08-30
    5G: A Challenge For Heat Dissipation From Rising Speed  As pluggable I/O data rates and bandwidth continue to increase, power consumption and heat generation are inevitably rising as well, causing adverse effects on high speed product’s performance and reliability. This is especially critical when it comes to 5G era when thermal performance has become one of the most challenging issues to be solved. This challenge is fully reflected in form factors such as QSFP-DD where thermal performance has great impact on overall high speed quality.
  • 2019-07-04
    Application industry ˙Medical Equipment ˙Security  ˙Robotic ˙Military communication ˙Industrial Features ˙Lightweight, small and easy handling  ...

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