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A 5G Heat Dissipation Solution: Fanless Industrial Chassis for Edge Computing
07 Mar 2021

A 5G Heat Dissipation Solution: Fanless Industrial Chassis for Edge Computing

Thermal Resistance & Ruggedized

Marking a significant step in communication technology, 5G, IoT and edge computing are key enablers for Industry 4.0.
 
One of the main issues faced frequently by large power consumption is the accompanying extreme high temperature. Developers have to accommodate heat dispassion and signal transmission into a compact design. And sometimes, outdoor waterproof requirements have to be considered.
 
Nextron’s Compact Fanless Chassis are designed to prevent system overheat under all circumstances. With over 30 years of understanding in embedded systems, from inhouse thermal simulation to appropriate mechanical parts and chassis designs, the designed chassis can withstand high temperature. The accuracy of heat simulation conducted by our experienced team is up to 98%.

Temperature Distribution

Features

The fanless chassis with aluminum diecasting cover, EMI shielding, PCB fixing mechanical, plating & coating and din rail clip will be a good choice to your small form factor system.
 
To reduce the total cost of development, Nextron leverage a series of off-the-shelf components including panels, guide pin, heat sink, and connectors as a total solution. 

For more information, please contact us via email or the contact form.

  • +886-2-6616-2000
  • marketing@nextron.com.tw
  • 2F, No. 31, Lane 169, Kang Ning Street, Hsi-chih District, New Taipei City, Taiwan
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